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Friday, January 25, 2002 Series 90-70 Update   VOLUME 1 ISSUE 23  
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- High-Density Discrete I/O for Series 90-70
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New high-density discrete I/O for the Series 90-70 are half-width modules that can be used in either a standard Series 90-70 rack or an integrator rack. When the modules are placed in the integrator rack, the I/O capacity is doubled. 

GE Fanuc now offers high-density discrete I/O VME modules that can be easily integrated into Series 90-70 controllers. With up to 64 discrete I/O on a module, cost can be reduced by as much as 50%.

The discrete modules provide high-speed data to the controller over the VME backplane. The 4VDC input module can also be configured to support Sequence-of-Events (SOE) and can store up to 3,000 events. There are two relay output modules and a 24VDC output module to chose from to satisfy a wide range of applications.

Application Benefits

  • The high-density analog modules enable panel space to be cut 50% to 75% or more. Traditional discrete modules for the Series 90-70 had a maximum of 32 points per module versus 64 points now available.

  • The built-in test feature on many of the modules provides quick diagnostics and reduces downtime. The built-in test checks the circuitry of the module and narrows down the point of failure.

  • High-density modules with cable connections can be terminated easily using the DIN Rail Transition Module, which provides a high-density screw terminal block with easy universal mounting.

Product Features

  • 24VDC Input Module

  • 64 optically isolated inputs.

  • Sequence-of-Event (SOE) option allows each change-of-state to be time-tagged in SOE buffer. The SOE buffer collects the channel ID and the time (time tag register) in which the state changed. This buffer can contain 3,000 events.

  •  24VDC Output Module

  • 64 outputs at 500 mAmp continuous

  • Output transient protected

  • Wired for Sink or Source outputs

  • Relay O utput Module

  • 64 or 32 points @ 2.0 amps current rating per point

  • Protection from relays changing during power up/down

  • Form C Single-Pole-Double-Through contacts

  • Compatibility

  • The high-density modules are compatible with all Series 90-70 CPUs and racks. Due to increased power consumption on the 5VDC supply, a high-capacity power supply may be required.

 For details, download the High-Density Discrete I/O data sheet.


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Published by Alicia Bowers
Copyright © 2002 GE Fanuc Automation. All rights reserved.
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